An Open-Hardware Platform for MPSoC Thermal Modeling

Summary

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Authors: Federico Terraneo, Alberto Leva, William Fornaciari

Journal title: Embedded Computer Systems: Architectures, Modeling, and Simulation - 19th International Conference, SAMOS 2019, Samos, Greece, July 7–11, 2019, Proceedings

Journal number: 11733

Journal publisher: Springer International Publishing

Published year: 2019

Published pages: 184-196

DOI identifier: 10.1007/978-3-030-27562-4_13

ISBN: 978-3-030-27561-7