3D-ICE 3.0: efficient nonlinear MPSoC thermal simulation with pluggable heat sink models

Summary

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Federico Terraneo, Alberto Leva, William Fornaciari, Marina Zapater, David Atienza

Journal title: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Journal publisher: Institute of Electrical and Electronics Engineers

Published year: 2020

Published pages: 1-1

DOI identifier: 10.1109/tcad.2021.3074613

ISSN: 0278-0070