Lab-scale cells laser-assisted sealed (Confidential Report)

Complete PSC devices (Semiconductor, absorber material, HTM, metal back contact) at lab-scale will be sealed with the optimized sealing technology at 120 ºC developed within WP4 (Tasks 5.1 and 5.2). The PSC materials to be used will be the best-performing ones available at month 24, developed in the framework of WPs 2-4. Complete assembling protocols will be reported.