Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding

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Authors: M. Inac, M. Wietstruck, A. Goritz, B. Cetindogan, C. Baristiran-Kaynak, M. Lisker, A. Kruger, A. Trusch, U. Saarow, P. Heinrich, T. Voss, M. Kaynak

Journal title: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

Journal publisher: IEEE

Published year: 2017

Published pages: 1-4

DOI identifier: 10.1109/eptc.2017.8277523

ISBN: 978-1-5386-3042-6