BiCMOS Integrated Microfluidic Packaging by Wafer Bonding for Lab-on-Chip Applications

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Authors: Mesut Inac, Matthias Wietstruck, Alexander Goritz, Barbaros Cetindogan, Canan Baristiran-Kaynak, Steffen Marschmeyer, Mirko Fraschke, Thomas Voss, Andreas Mai, Cristiano Palego, Arnaud Pothier, Mehmet Kaynak

Journal title: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Journal publisher: IEEE

Published year: 2017

Published pages: 786-791

DOI identifier: 10.1109/ECTC.2017.153

ISBN: 978-1-5090-6315-4