The Effect of Surface Optimization on Post-grinding Yield of 200 mm Wafer Level Packaging Applications

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Authors: Mesut Inac, Matthias Wietstruck, Alexander Goritz, Barbaros Cetindogan, Canan Baristiran-Kaynak, Marco Lisker, Andreas Kruger, Ulrike Saarow, Patric Heinrich, Thomas Voss, Kasim Altin, Mehmet Kaynak

Journal title: 2018 7th Electronic System-Integration Technology Conference (ESTC)

Journal publisher: IEEE

Published year: 2018

Published pages: 1-4

DOI identifier: 10.1109/ESTC.2018.8546457

ISBN: 978-1-5386-6814-6