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Authors: Viktor Sverdlov, Alexander Makarov, Thomas Windbacher, Siegfried Selberherr
Journal title: 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
Journal publisher: IEEE
Published year: 2016
Published pages: 315-318
DOI identifier: 10.1109/SISPAD.2016.7605210
ISBN: 978-1-5090-0818-6
