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Authors: A. Moerman, J. Van Kerrebrouck, O. Caytan, I. Lima de Paula, L. Bogaert, G. Torfs, P. Demeester, H. Rogier, S. Lemey
Journal title: IEEE Communications Magazine
Journal publisher: Institute of Electrical and Electronics Engineers
Published year: 2022
DOI identifier: 10.1109/mcom.001.2100550
ISSN: 0163-6804