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Authors: L. Romano, J. Vila-Comamala, K. Jefimovs, M. Stampanoni
Journal title: Microelectronic Engineering
Journal number: 177
Journal publisher: Elsevier BV
Published year: 2017
Published pages: 59-65
DOI identifier: 10.1016/j.mee.2017.02.008
ISSN: 0167-9317