Integration of HfO2-based 3D OxRAM with GAA stacked-nanosheet transistor for high-density embedded memory

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: T. Dubreuil;S. Barraud;J.-M. Pedini;J.-M. Hartmann;F. Boulard;A. Sarrazin;A. Gharbi;J. Sturm;A. Lambert;S. Martin;N. Castellani;A. Anotta;A. Magalhaes-Lucas;A. Souhaité;F. Andrieu

Journal title: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

Journal publisher: IEEE

Published year: 2023

DOI identifier: 10.1109/essderc59256.2023.10268513