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Authors: Hong-Linh Truong, Luca Berardinelli
Journal title: Proceedings of the 1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems - TECPS 2017
Journal publisher: ACM Press
Published year: 2017
Published pages: 5-8
DOI identifier: 10.1145/3107091.3107093
ISBN: 9781-450351126