Photonic Wire Bonding and 3D Nanoprinting in Photonic Integration – from Lab Demonstrations to Production

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Authors: C. Koos, W. Freude, S. Randel, M. R. Billah, M. Blaicher, P.-I. Dietrich, T. Hoose, Y. Xu, J. N. Kemal, A. Nesic, A. Hofmann

Journal title: 2018 European Conference on Optical Communication (ECOC)

Journal number: 23-27 Sept. 2018

Journal publisher: IEEE

Published year: 2018

Published pages: 1-2

DOI identifier: 10.1109/ecoc.2018.8535426

ISBN: 978-1-5386-4862-9