Advanced sensor systems by low-temperature heterogeneous 3D integration processes

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Montserrat Fernandez-Bolanos, Andrei Muller, Josef Weber, Peter Ramm

Journal title: 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

Journal publisher: IEEE

Published year: 2018

Published pages: 1-5

DOI identifier: 10.1109/DTIP.2018.8394203

ISBN: 978-1-5386-6199-4