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Authors: J.-Ch. Barbe, S. Barraud, O. Rozeau, S. Martinia, J. Lacord, P. Blaise, Z. Zeng, L. Bourdet, F. Triozon, Y. Niquet
Journal title: 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
Journal publisher: IEEE
Published year: 2017
Published pages: 5-8
DOI identifier: 10.23919/sispad.2017.8085250
ISBN: 978-4-86348-610-2
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