Modeling electromigration in nanoscaled copper interconnects

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Authors: L. Filipovic, R.L. de Orio, W.H. Zisser, S. Selberherr

Journal title: 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Journal publisher: IEEE

Published year: 2017

Published pages: 161-164

DOI identifier: 10.23919/sispad.2017.8085289

ISBN: 978-4-86348-610-2