Modeling the Influence of Grains and Material Interfaces on Electromigration

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Authors: Lado Filipovic, Roberto Lacerda de Orio

Journal title: 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Journal publisher: IEEE

Published year: 2018

Published pages: 83-87

DOI identifier: 10.1109/sispad.2018.8551746

ISBN: 978-1-5386-6790-3