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Authors: L. Wang, B. Cheng, P. Asenov, A. Pender, D. Reid, F. Adamu-Lema, C. Millar, A. Asenov
Journal title: 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
Journal publisher: IEEE
Published year: 2016
Published pages: 157-160
DOI identifier: 10.1109/SISPAD.2016.7605171
ISBN: 978-1-5090-0818-6
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