Simulation of induction thermography NDT technique using SIBC

Summary

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Authors: Abdoulaye Ba, Huu Kien Bui, GĂ©rard Berthiau, Didier Trichet, Guillaume Wasselynck

Journal title: COMPEL - The international journal for computation and mathematics in electrical and electronic engineering

Journal number: ahead-of-print/ahead-of-print

Journal publisher: Emerald Group Publishing Ltd.

Published year: 2020

DOI identifier: 10.1108/COMPEL-01-2020-0007

ISSN: 0332-1649