3D Finite Element Model using SIBC to Accelerate Electromagnetic Thermal Simulation of Induction Thermography Technique

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Authors: Abdoulaye Ba, Huu-Kien Bui, Gerard Berthiau, Didier Trichet, Guillaume Wasselynck

Journal title: 2019 19th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF)

Journal publisher: IEEE

Published year: 2019

Published pages: 1-2

DOI identifier: 10.1109/isef45929.2019.9097101

ISBN: 978-1-7281-1560-3