28nm FDSOI CMOS Technology (FEOL and BEOL) Thermal Stability for 3D Sequential Integration: Yield and Reliability Analysis

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Authors: C. Cavalcante, C. Fenouillet-Beranger, P. Batude, X. Garros, X. Federspiel, J. Lacord, S. Kerdiles, A. S. Royet, P. Acosta-Alba, O. Rozeau, V. Barral, F. Arnaud, N. Planes, P. O. Sassoulas, E. Ghegin, R. Beneyton, M. Gregoire, O. Weber, C. Guerin, L. Arnaud, S. Moreau, R. Kies, G. Romano, N. Rambal, A. Magalhaes, G. Ghibaudo, J. P. Colinge, M. Vinet, F. Andrieu

Journal title: 2020 IEEE Symposium on VLSI Technology

Journal publisher: IEEE

Published year: 2020

Published pages: 1-2

DOI identifier: 10.1109/vlsitechnology18217.2020.9265075

ISBN: 978-1-7281-6460-1