A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit

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Authors: F. Andrieu, P. Batude, L. Brunet, C. Fenouillet-Beranger, D. Lattard, S. Thuries, O. Billoint, R. Fournel, M. Vinet

Journal title: 2018 International Conference on IC Design & Technology (ICICDT)

Journal publisher: IEEE

Published year: 2018

Published pages: 141-144

DOI identifier: 10.1109/icicdt.2018.8399776

ISBN: 978-1-5386-2550-7