3D Sequential Integration: Application-driven technological achievements and guidelines

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Authors: P. Batude, L. Brunet, C. Fenouillet-Beranger, F. Andrieu, J.-P. Colinge, D. Lattard, E. Vianello, S. Thuries, O. Billoint, P. Vivet, C. Santos, B. Mathieu, B. Sklenard, C.-M. V. Lu, J. Micout, F. Deprat, E. Avelar Mercado, F. Ponthenier, N. Rambal, M.-P. Samson, M. Casse, S. Hentz, J. Arcamone, G. Sicard, L. Hutin, L. Pasini, A. Ayres, O. Rozeau, R. Berthelon, F. Nemouchi, P. Rodriguez, J.-B. Pin,

Journal title: 2017 IEEE International Electron Devices Meeting (IEDM)

Journal publisher: IEEE

Published year: 2017

Published pages: 3.1.1-3.1.4

DOI identifier: 10.1109/iedm.2017.8268316

ISBN: 978-1-5386-3559-9