Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents

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Authors: Sabrina Patricia Rosoiu, Stefania Costovici, Calin Moise, Aurora Petica, Liana Anicai, Teodor Visan, Marius Enachescu

Journal title: Electrochimica Acta

Journal number: 398

Journal publisher: Pergamon Press Ltd.

Published year: 2021

Published pages: 139339

DOI identifier: 10.1016/j.electacta.2021.139339

ISSN: 0013-4686