Periodic Reporting for period 2 - PICTURE (High Performance and High Yield Heterogeneous III-V/Si Photonic Integrated Circuits using a Thin and Uniform Bonding Layer)

The data rate of the signals being transported in today’s networks is increasing at a steady pace, due to the booming communication needs. Transporting data with existing technologies will soon reach major limits, in terms of power consumption, device density and weight of...