micro-transfer-printing for photonic integrated circuits

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Authors: J. Zhang, G. Muliuk, C. Op de Beeck, J. Goyvaerts, B. Haq, S. Kumari, B. Kuyken, J. Van Campenhout, R. Baets, G. Roelkens, J. Van Campenhout, G. Lepage, P. Verheyen, A. Gocalinska, E. Pelucchi, B. Corbett, A. Jose Trindade, C. Bower

Journal title: International Conference on Wafer Bonding

Journal number: 2nd-4th Dec. 2019 (Wafer Bond '2019)

Journal publisher: Fraunhofer

Published year: 2019