Modified Lignin/PLA Composites For Packaging Application

Summary

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Authors: Esakkiammal Sudha Esakkimuthu, David DeVallance, Mika H. Sipponen

Journal title: Proceedings of the 2nd International Conference on Circular Packaging

Journal publisher: Pulp and Paper Institute, Slovenia and Faculty of Polymer Technology, Slovenia

Published year: 2021

DOI identifier: 10.5281/zenodo.5532469

ISBN: 978-961-90424-6-5