Report on Ø300mm wafer processing methodology, WiW and WtW uniformity

Summary
WiW: TMR and RA uniformity <6% @ RA=10 Ohm.µm². WtW: TMR and RA <4% @ RA=10 Ohm.µm².
More information & hyperlinks
Web resources: https://www.ec.europa.eu/research/participants/documents/downloadPublic?documentIds=080166e5b51a80b6&appId=PPGMS
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