Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding

Summary

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: Arne Quellmalz, Simon Sawallich, Maximilian Prechtl, Oliver Hartwig, Siwei Luo, Stefan Wagner, Georg S. Duesberg, Max C. Lemme, Frank Niklaus, Kristinn B. Gylfason

Journal title: Conference on Lasers and Electro-Optics

Journal publisher: OSA

Published year: 2021

Published pages: SW3F.2

DOI identifier: 10.1364/cleo_si.2021.sw3f.2

ISBN: 978-1-943580-91-0