Tilt- and warpage measurement of bonded dies as an inline quality assessment tool

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Authors: D. May; J. Heilmann; E. Boschman; M. Abo Ras; B. Wunderle

Journal title: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Journal number: 22th

Journal publisher: IEEE

Published year: 2021

DOI identifier: 10.1109/eurosime52062.2021.9410832

ISBN: 978-1-6654-1373-2