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Authors: D. R. Wargulski; D. May; J. Petrick; R. Schacht; B. Wunderle; M. Abo Ras All Authors
Journal title: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal number: 26th
Journal publisher: IEEE
Published year: 2020
DOI identifier: 10.1109/therminic49743.2020.9420531
ISBN: 978-1-7281-7643-7