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Authors: Dan R. Wargulski; Daniel May; Florian Löffler; Torsten Nowak; Jan Petrick; Corinna Grosse; Bernhard Wunderle; Eef Boschman; Mohamad Abo Ras
Journal title: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal number: 25th
Journal publisher: IEEE
Published year: 2019
DOI identifier: 10.1109/therminic.2019.8923598
ISBN: 978-1-7281-2078-2