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Authors: S. Panahandeh; D. May; D.R. Wargulski; E. Boschman; R. Schacht; M. Abo Ras; B. Wunderle
Journal title: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2021
DOI identifier: 10.1109/eurosime52062.2021.9410883
ISBN: 978-1-6654-1373-2
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