Comparative Die-Attach Failure Analysis by Thermoreflectance, Infrared Thermography and Scanning Acoustic Microscopy

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Authors: Dan R. Wargulski; Florian Löffler; Daniel May; Jens Heilmann; Bernhard Wunderle; Ana Borta-Boyon; Afshin Ziaei; Mohamad Abo Ras

Journal title: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Journal number: 24rd

Journal publisher: IEEE

Published year: 2018

DOI identifier: 10.1109/therminic.2018.8593331

ISBN: 978-1-5386-6759-0