Thermal Characterization and Failure Analysis of MMIC Components by Thermo-Reflectance Imaging

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: D. May; M. Gora; D. Wargulski; F. Löffler; M. Abo Ras; A. Borta-Boyon; A. Ziaei; B. Wunderle

Journal title: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Journal number: 26th

Journal publisher: IEEE

Published year: 2020

DOI identifier: 10.1109/therminic49743.2020.9420519

ISBN: 978-1-7281-7643-7