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Authors: Kaushal Arun Pareek; Daniel May; Mohamad Abo Ras; Bernhard Wunderle
Journal title: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal number: 22th
Journal publisher: IEEE
Published year: 2021
DOI identifier: 10.1109/eurosime52062.2021.9410885
ISBN: 978-1-6654-1373-2
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