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Authors: George A. Oguntala, Gbeminiyi Sobamowo, Nnabuike N. Eya, Raed A. Abd-Alhameed
Journal title: IEEE Transactions on Components, Packaging and Manufacturing Technology
Journal publisher: Institute of Electrical and Electronics Engineers Inc.
Published year: 2018
Published pages: 1-1
DOI identifier: 10.1109/TCPMT.2018.2878737
ISSN: 2156-3950