Reliability and failure modelling of microelectronic packages based on ultrasonic nondestructive evaluation data

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Authors: Haotian Wang, Guang-Ming Zhang, Hongwei Ma, Xuhui Zhang, Teresa Partida Manzanera, Derek Braden, David Mark Harvey, Mohd Arif Anuar Mohd Salleh

Journal title: Elsevier

Journal number: NDT & E International

Journal publisher: Elsevier BV

Published year: 2023

DOI identifier: 10.1016/j.ndteint.2023.102856

ISSN: 0963-8695