3D Printed Structural Electronics: embedding and connecting electronic components into freeform electronic devices

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Authors: H.Maalderink, F. Bruning, M. de Schipper, J. van der Werff, W. Germs, E. Meinders, R. Mandamparambil Polymer & Moulds Innovations (PMI2016), Ghent (Belgium), 21-23 September 2016

Journal title: Polymer & Moulds Innovations (PMI2016)

Journal publisher: PMI2016

Published year: 2016