Heat spreading performance of SiC-based power module with bonded vapour chamber for electric powertrain integration

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Authors: Li, B., Chen, Y., Wang, X., Li, Y., Yan, Y.

Journal title: Applied Thermal Engineering

Journal publisher: Science Direct

Published year: 2020

DOI identifier: 10.1016/j.applthermaleng.2020.115896

ISSN: 1938-2774