Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products.

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Authors: Marek Koscielski, Janusz Sitek, Piotr Ciszewski, Piotr Dawidowicz, Aneta Arazna, Kamil Janeczek, Wojciech Steplewski, Gerhard Podhradsky, Roland Ambrosch

Journal title: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Journal publisher: IEEE

Published year: 2019

Published pages: 1-5

DOI identifier: 10.23919/empc44848.2019.8951884

ISBN:978-0-9568086-6-0