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Authors: Roberto Bomfin, Dan Zhang, Maximilian Matthe, Gerhard Fettweis
Journal title: IEEE Communications Letters
Journal number: 22/11
Journal publisher: Institute of Electrical and Electronics Engineers
Published year: 2018
Published pages: 2394-2397
DOI identifier: 10.1109/lcomm.2018.2870175
ISSN: 1089-7798