Wafer-Level Vacuum Sealing by Transfer Bonding of Silicon Caps for Small Footprint and Ultra-Thin MEMS Packages

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Authors: Xiaojing Wang, Simon J. Bleiker, Pierre Edinger, Carlos Errando-Herranz, Niclas Roxhed, Goran Stemme, Kristinn B. Gylfason, Frank Niklaus

Journal title: Journal of Microelectromechanical Systems

Journal publisher: Institute of Electrical and Electronics Engineers

Published year: 2019

Published pages: 1-12

DOI identifier: 10.1109/jmems.2019.2910985

ISSN: 1057-7157