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Authors: R. Hersent , A. Konczykowska , F. Jorge , F. Blache, V. Nodjiadjim , M. Riet, C. Mismer, and J. Renaudier
Journal title: IEEE Microwave and Wireless Components Letters
Journal number: vol. 32, no. 6
Journal publisher: Institute of Electrical and Electronics Engineers Inc.
Published year: 2022
Published pages: pp. 752-755
DOI identifier: 10.1109/lmwc.2022.3161706
ISSN: 2169-3536