Summary
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Authors: A. Konczykowska, R. Hersent, F. Jorge, M. Riet, V. Nodjiadjim, C. Mismer, C. R. Bolognesi, O. Ostinelli, J.-Y. Dupuy
Journal publisher: IEEE
Published year: 2022
DOI identifier: 10.23919/mikon54314.2022.9924653