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Authors: J. P. Colonna, G. Savelli, A. Royer, P. Coudrain, M. Keller, Y. Manoli, L. G. Frechette, L-M. Collin, S. Billat, J Barrau
Journal title: 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal publisher: IEEE
Published year: 2018
Published pages: 1-5
DOI identifier: 10.1109/therminic.2018.8593310
ISBN: 978-1-5386-6759-0