Shaping circuit environment to face the thermal challenge Innovative technologies from low to high power electronics

This is a publication. If there is no link to the publication on this page, you can try the pre-formated search via the search engines listed on this page.

Authors: P. Coudrain, J.-P. Colonna, L.-M. Collin, R. Prieto, L.G. Frechette, J. Barrau, G. Savelli, P. Vivet, Q. Struss, J. Widiez, K. Vladimirova, K. Triantopoulos, H. Beckrich-Ros, M. Vilarrubi, G. Laguna, H. Azarkish, M. Shirazi, J. Michailos

Journal title: 2018 IEEE Symposium on VLSI Technology

Journal publisher: IEEE

Published year: 2018

Published pages: 15-16

DOI identifier: 10.1109/vlsit.2018.8510677

ISBN: 978-1-5386-4218-4