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Authors: G. Laguna, H. Azarkish, M. Vilarrubi, M. Ibanez, J. Roseli, Y. Betancourt, J. Illa, L.-M. Collin, J. Barrau, L. Frechette, P. Coudrain, G. Savelli
Journal title: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Journal publisher: IEEE
Published year: 2017
Published pages: 1-4
DOI identifier: 10.1109/therminic.2017.8233790
ISBN: 978-1-5386-1928-5
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