Understanding the substrate effect on de-embedding structures fabricated on SOI wafers using electromagnetic simulation

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Authors: B. Neckel Wesling, M. Deng, C. Mukherjee, T. Mikolajick, J. Trommer and C. Maneux

Journal title: IEEE International Conference on Microelectronic Test Structures (ICMTS), April 2024, Edinburgh, Scotland

Journal number: Avr 24

Journal publisher: IEEE

Published year: 2024