Modular Heat Sinks for Enhanced Thermal Management of Electronics

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Authors: Hoque, M. J., Gunay, A. A., Stillwell, A., Gurumukhi, Y., Pilawa-Podgurski, R. C. N., & Miljkovic, N.

Journal title: vol.143, no.2

Journal publisher: ASME

Published year: 2021

DOI identifier: 10.1115/1.4049294

ISSN: 1043-7398