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Authors: Pardy, Tamás; Scheler, Ott; Gyimah, Nafisat; Rang, Toomas
Journal title: 23rd Annual International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Journal publisher: IEEE
Published year: 2022
DOI identifier: 10.1109/eurosime54907.2022.9758876
ISBN: 978-1-6654-5836-8